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  1/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. single-chip type with built-in fet switching regulator series low noise high efficiency step-down switching regulator with built-in power mosfet BD8964FVM description rohm?s high efficiency step-down switching regulator bd8964f vm is a power supply designed to produce a low voltage including 1 volts from 5/3.3 volts power supply line. offers high efficiency with synchronous rectifier. employs a current mode control system to provide faster transie nt response to sudden change in load. features 1) offers fast transient response with current mode pwm control system. 2) offers highly efficiency for all load range with synchronous rectifier (nch/pch fet) 3) incorporates soft-start function. 4) incorporates thermal protection and ulvo functions. 5) incorporates short-current protec tion circuit with time delay function. 6) incorporates shutdown function 7) employs small surface mount package : msop8 use power supply for lsi including dsp, micro computer and asic line up parameter symbol limits unit v cc voltage v cc -0.3 +7 *1 v pv cc voltage pv cc -0.3 +7 *1 v en voltage v en -0.3 +7 v sw,ith voltage v sw ,v ith -0.3 +7 v power dissipation 1 pd1 387.5 *2 mw power dissipation 2 pd2 587.4 *3 mw operating temperature range topr -25 +85 storage temperature range tstg -55 +150 maximum junction temperature tjmax +150 1 pd should not be exceeded. 2 derating in done 3.1mw/ for temperatures above ta=25 . 3 derating in done 4.7mw/ for temperatures above ta=25 , mounted on 70mm70mm1.6mm glass epoxy pcb. operating conditions (ta=25 ) parameter symbol limits unit min. typ. max. v cc voltage v cc *4 4.0 5.0 5.5 v pv cc voltage p vcc *4 4.0 5.0 5.5 v en voltage v en 0 - vcc v output voltage setting range v out 1.0 - 1.8 v sw average output current isw *4 - - 1.2 a 4 pd should not be exceeded. no.09027eat23
BD8964FVM technical note 2/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. electrical characteristics (ta=25 , v cc =5v, en=v cc , r 1 =20k ? , r 2 =10k ? unless otherwise specified.) parameter symbol min. typ. max. unit conditions standby current i stb - 0 10 a en=gnd bias current i cc - 250 450 a en low voltage v enl - gnd 0.8 v standby mode en high voltage v enh 2.0 v cc - v active mode en input current i en - 1 10 a v en =5v oscillation frequency f osc 0.8 1 1.2 mhz pch fet on resistance r onp - 350 600 m ? p vcc =5v nch fet on resistance r onn - 250 500 m ? p vcc =5v adj voltage v adj 0.78 0.80 0.82 v ith si nk current i thsi 10 20 - a v adj =h ith s ource c urrent i thso 10 20 - a v adj =l uvlo threshold voltage v uvlo1 3.6 3.8 4.0 v v cc =4 0v uvlo release voltage v uvlo2 3.65 3.90 4.2 v v cc =0 4v soft start time t ss 0.5 1 2 ms v adj =h timer latch time t latch 1 2 3 ms scp/tsd operated block diagram, application circuit pin no. & function table pin no. pin name pin function 1 adj output voltage detect pin 2 ith gmamp output pin/connected phase compensation capacitor 3 en enable pin(active high) 4 gnd ground 5 pgnd nch fet source pin 6 sw pch/nch fet drain output pin 7 pv cc pch fet source pin 8 v cc vcc power supply input pin fig.1 BD8964FVM view fig.2 BD8964FVM block diagram 41 58 0.475 0.65 2.80.1 2.90.1 4.00.2 0.750.05 0.080.05 0.290.15 0.60.2 0.9max. 0.08 s 0.145 0.22 +0.05 -0.04 +0.05 -0.03 s 4 +6 -4 max3.25(include.burr) d 8 9 6 4 lot no. 1pin mark v ref osc uvlo tsd current sense/ protect driver logic + soft start 8 7 6 5 4 2 1 3 r q s en v cc pv cc input sw output pgnd gnd ith a dj v cc slope current comp. gm amp. clk v cc
BD8964FVM technical note 3/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. characteristics data (reference data) 0.0 0.5 1.0 1.5 2.0 012345 input voltage:v cc [v] output voltage:vout[v] ta = 2 5 io=0a 0.0 0.5 1.0 1.5 2.0 0123 output current:i out [a] output voltage:vout[v] vcc=5v ta = 2 5 0.0 0.5 1.0 1.5 2.0 012345 en voltage:ven[v] output voltage:vout[v] vcc=5v ta = 2 5 io=0a v out =1.5v v out =1.5v v out =1.5v 0.80 0.85 0.90 0.95 1.00 1.05 1.10 1.15 1.20 -25 -15 -5 5 15 25 35 45 55 65 75 85 temperature:ta[ ] frequency:f osc [mhz] 1.45 1.46 1.47 1.48 1.49 1.50 1.51 1.52 1.53 1.54 1.55 -25-15-5 5 1525 354555657585 temperature:ta[ ] output voltage:vout[v] 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 output current:i out [ma] efficiency: [%] v out =1.5v v out =1.5v vcc=5v io=0a vcc=5v ta = 2 5 0 50 100 150 200 250 300 350 -25-15-5 5 1525354555657585 temperature:ta[ ] circuit current:i cc [ a] 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -25-15-5 5 1525354555 657585 temperature:ta[ ] en voltage:ven[v] 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 -25-15-5 5 1525354555657585 temperature:ta[ ] on resistance:r on [ ] pmos nmos vcc=5v vcc=5v vcc=5v fig.3 vcc-vout fig.5 iout-vout fig.4 ven-vout fig.8 ta-f osc fig.6 ta-v out fig.7 efficiency fig.11 ta-i cc fig.10 ta-v en fig.9 ta-r onn , r onp
BD8964FVM technical note 4/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. fig.16 transient response io=600 100ma(10 s) 0.8 0.9 1 1.1 1.2 44.5 55.5 input voltage:v cc [v] frequency:f osc [mhz] sw v out vcc=5v ta = 2 5 sllm tm v out =1.5v v out v cc =pv cc =en v out =1.5v vcc=5v ta = 2 5 io=0 a fig. 15 transient response io=100 600ma ( 10 s ) vcc=5v t a =2 5 v out =1.5v v out i out v out i out vcc=5v ta = 25 v out =1.5v 58mv 62mv fi g .12 vcc-fosc fi g .14 sw waveform fi g .13 soft start waveform
BD8964FVM technical note 5/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. information on advantages advantage 1 offers fast transient response with current mode control system. voltage drop due to sudden change in load was reduced fig.17 comparison of transient response advantage 2 offers high efficiency with synchronous rectifier ? for heavier load: utilizes the synchronous rectifyi ng mode and the low on-resistance mos fets incorporated as power transistor. on resistance of p-channel mos fet : 350m ? (typ.) on resistance of n-channel mos fet : 250m ? (typ.) advantage 3 ? supplied in smaller package due to small-sized power mos fet incorporated. reduces a mounting area required. fig.19 example application r ith l co v out c ith v cc cin 10mm 15mm r ith c ith c in c o l fi g. 18 effi c i ency conventional product (load response i o =0.1a 0.6a) BD8964FVM (load response i o =0.1a 0.6a) ? output capacitor co required for current mode control: 10 f ceramic capacitor ? inductance l required for the oper ating frequency of 1 mhz: 4.7 h inductor dc/dc convertor controller 110mv v out i out v out i out 58mv 0 10 20 30 40 50 60 70 80 90 100 1 10 100 1000 10000 output current:i out [ma] efficiency: BD8964FVM technical note 6/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. operation BD8964FVM is a synchronous rectifying step- down switching regulator t hat achieves faster transi ent response by employing current mode pwm control system. synchronous rectifier it does not require the power to be dissipated by a rectifier externally connected to a conventional dc/dc converter ic, and its p.n junction shoot-through protection circuit limits the shoot-through current during operation, by which the power dissipation of the set is reduced. current mode pwm control synthesizes a pwm control signal with a inductor current feedback loop added to the voltage feedback. ? pwm (pulse width modulation) control the oscillation frequency for pwm is 1 mhz. set si gnal form osc turns on a p-channel mos fet (while a n-channel mos fet is turned off), and an inductor current i l increases. the current comparator (current comp) receives two signals, a current feedback contro l signal (sense: voltage converted from i l ) and a voltage feedback control signal (fb), and issues a reset signal if both input signals are identical to each other, and turns off the p-channel mos fet (while a n-channel mos fet is turned on ) for the rest of the fixe d period. the pwm control repeat this operation. fig.20 diagram of current mode pwm control osc level shift driver logic rq s i l sw ith current comp gm amp. set reset fb load sense v out v out fi g. 21 pwm sw i tc hi ng t i m i ng c h art curren t comp set reset sw v out pvcc gnd gnd gnd i l (ave) v out (ave) sense fb i l
BD8964FVM technical note 7/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. description of operations ? soft-start function en terminal shifted to ?high? activates a soft-starter to gradually establish the output voltage with the current limited durin g startup, by which it is possible to prevent an ov ershoot of output voltage and an inrush current. ? shutdown function with en terminal shifted to ?low?, the device turns to standby mode, and all the function blocks including reference voltage circuit, internal oscillator and drivers are turn ed to off. circuit current during standby is 0 f (typ.). ? uvlo function detects whether the input voltage sufficient to secure the output voltage of this ic is supplied. and the hysteresis width of 300mv (typ.) is provided to prevent output chattering. fig.22 soft start, shutdown, uvlo timing chart ? short-current protection circuit with time delay function turns off the output to protect the ic fr om breakdown when the incorporated current limiter is activated continuously for at least 1 ms. the output thus held tuned off may be recovered by restarting en or by re-unlocking uvlo. fig.23 short-current protection circuit with time delay timing chart hysteresis 100mv ts s ts s ts s soft start standby mode operating mode standby mode operating mode standby mode operating mode standby mode uvlo en uvlo uvlo v cc en v ou t 1msec output off latch en v out limi t i l standby mode operating mode standby mode operating mode en timer latch en
BD8964FVM technical note 8/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. switching regulator efficiency efficiency ? may be expressed by the equation shown below: efficiency may be improved by reducing the swit ching regulator power dissipation factors p d as follows: dissipation factors: 1) on resistance dissipation of inductor and fet pd(i 2 r) 2) gate charge/discharge dissipation pd(gate) 3) switching dissipation pd(sw) 4) esr dissipation of capacitor pd(esr) 5) operating current dissipation of ic pd(ic) 1)pd(i 2 r)=i out 2 (r coil +r on ) (r coil [ ? ] dc resistance of inductor, r on [ ? ] on resistance of fet, i out [a] output current.) 2)pd(gate)=cgsfv (cgs[f] gate capacitance of fet, f[hz] switching frequency, v[v] gate driving voltage of fet) 4)pd(esr)=i rms 2 esr (i rms [a] ripple current of capacitor, esr[ ? ] equivalent series resistance.) 5)pd(ic)=vini cc (i cc [a] circuit current.) consideration on permissible dissipation and heat generation as this ic functions with high efficiency without significant heat generation in most applications, no special consideration is needed on permissible dissipation or heat generation. in case of extreme conditions, however, including lower input voltage, higher output voltage, heavier load, and/or higher temperature, the permissible dissipation and/or heat generation must be carefully considered. for dissipation, only conduction losses due to dc resistance of inductor and on resistance of fet are considered. because the conduction losses are considered to play the leading role among other dissipation mentioned above including gate charge/discharge dissipation and switching dissipation. p=i out 2 (r coil +r on ) r on =dr onp +(1-d)r onn d on duty (=v out /v cc ) r coil dc resistance of coil r onp on resistance of p-channel mos fet r onn on resistance of n-channel mos fet i out output current if v cc =5v, v out =1.5v, r coil =0.15 ? , r onp =0.35 ? , r onn =0.25 ? i out =0.8a, for example, d=v out /v cc =1.5/5=0.3 r on =0.30.35+(1 -0.3)0.25 =0.105+0.175 =0.28[ ? ] p =0.8 2 (0.15+0.28) P 275.2[mw] as r onp is greater than r onn in this ic, the dissipation increases as the on duty becomes greater. with the consideration on the dissipation as above, the rmal design must be carried out with sufficient margin allowed. = v out i out vin iin 100[%]= p out pin 100[%]= p out p out +p d 100[%] vin 2 c rss i out f i drive 3)pd(sw)= (c rss [f] reverse transfer capacitance of fet, i drive [a] peak current of gate.) 0 200 400 600 800 1000 387.5mw 587.4mw using an ic alone j-a=322.6 /w mounted on glass epoxy pcb j-a=212.8 /w power dissipation:pd [mw] 0 25 50 75 100 125 150 85 fig. 24
BD8964FVM technical note 9/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. selection of components externally connected 1. selection of inductor (l) * current exceeding the current rating of t he inductor results in magnetic saturation of the inductor, which decreases efficien cy. the inductor must be selected allowing sufficient margin with which the peak current may not exceed its current rating. if v cc =5v, v out =1.5v, f=1mhz, i l =0.30.8a=0.24a, for example, *select the inductor of low resistance component (such as dcr and acr) to minimize dissipation in the inductor for better effic iency. 2. selection of output capacitor (c o ) as the output rise time must be designed to fall within the so ft-start time, the capacitance of output capacitor should be determined with consideration on the requirements of equation (5): in case of BD8964FVM, for instance, and if v out =1.5v, i out =0.8a, and t ss =1ms, inappropriate capacitance may cause problem in startup. a 10 f to 100 f ceramic capacitor is recommended. 3. selection of input capacitor (cin) a low esr 10 f/10v ceramic capacitor is recommended to reduce esr di ssipation of input capacitor for better efficiency. input capacitor to select must be a low esr capacitor of the capacitance sufficient to cope with high ripple current to prevent high transient voltage. the ripple current irms is given by the equation (5): i rms =i out v out ( v cc -v out ) v cc [ a ] ??? ( 5 ) when vcc is twice the v out , i rms = i out 2 < worst case > i rms(max.) fig.27 input capacitor v cc l co v out cin if v cc =5.0v, v out =1.5v, and i outmax.= 0.8a the inductance significantly depe nds on output ripple current. a s seen in the equation (1), the ripple current decreases as the inductor and/or switching frequency increases. i l = (v cc -v out )v out lv cc f [a] ??? ( 1 ) a ppropriate ripple current at output should be 30% more or less of the maximum output current. i l =0.3i out max. [a] ???(2) l= (v cc -v out )v out i l v cc f [h] ??? ( 3 ) ( i l : output ripple current, and f: switching frequency) output capacitor should be selected with the consideration on the stability region and the equivalent series resistance re quired to smooth ripple voltage. output ripple voltage is determined by the equation (4) v out = i l esr [v] ???(4) ( i l : output ripple current, esr: equivalent se ries resistance of output capacitor) *rating of the capacitor should be determi ned allowing sufficient margin against output voltage. less esr allows reduction in output ripple voltage. fig.26 output capacitor coQ t ss (i limit -i out ) v out ??? ( 5 ) tss: soft-start time i limit : over current detection level, 2a(typ) i l fig.25 output ripple current i l v cc il l co vout v cc l co v out esr ( 5-1.5 ) 1.5 0.2451m l= =4.375 4.7[ h] coQ 1m(2-0.8) 1.5 P800[ f] i rms =0.8 5 ( 5-1.5 ) 5 =0.67 [ a rms ]
BD8964FVM technical note 10/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. 4. determination of rith, cith that works as a phase compensator as the current mode control is designed to limit a inductor current, a pole (phase lag) appears in the low frequency area due to a cr filter consisting of a output capacitor and a load resistance, while a zero (phase lead) appears in the high frequency area due to the output capacitor and its esr. so, the phases are easily compensated by adding a zero to the power amplifier output with c and r as described bel ow to cancel a pole at the power amplifier. stable feedback loop may be achieved by canceling the pole fp (min.) produced by the output capacitor and the load resistance with cr zero correction by the error amplifier. 5. determination of output voltage the output voltage v out is determined by the equation (7): v out =(r2/r1+1) v adj ???(7) v adj : voltage at adj terminal (0.8v typ.) with r1 and r2 adjusted, the output vo ltage may be determined as required. (adjustable output voltage range 1.0v 1.8v) use 1 k ? 100 k ? resistor for r1. if a resistor of the resistance higher than 100 k ? is used, check the assembled set carefully for ripple voltage etc. fig.31 determination of output voltage fig.28 open loop gain characteristics fig.29 error amp phase compensation characteristics fp= 2 r o c o 1 fz (esr) = 2 e sr c o 1 pole at power amplifie r when the output current decreases, the load resistance ro increases and the pole frequency lowers. fp (min.) = 2 r omax. c o 1 [hz] with lighter load fp (max.) = 2 r omin. c o 1 [hz] with heavier load zero at power amplifie r fz (amp.) = 2 r ith c ith 1 gnd,pgnd sw v cc ,pv cc en v out ith v cc v out cin r ith c ith l esr c o r o v out fig.30 typical application fz (amp.) = fp (min.) 2 r ith c ith 1 = 2 r omax. c o 1 increasing capacitance of the out put capacitor lowers the pole frequency while the zero frequency does not change. (this is because when the capacitance is doubled, the capacito r esr reduces to half.) sw 6 1 a dj 4.7h 10f r2 r1 output gain [db] phase [deg] a 0 0 -90 a 0 0 -90 fz(amp.) fp(min.) fp(max.) fz(esr) i out min. i out max. gain [db] phase [deg]
BD8964FVM technical note 11/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. BD8964FVM cautions on pc board layout fig.32 layout diagram for the sections drawn with heavy line, use th ick conductor pattern as short as possible. lay out the input ceramic capacitor cin closer to the pi ns pvcc and pgnd, and the output capacitor co closer to the pin pgnd. lay out cith and rith between the pi ns ith and gnd as near as possible with least necessary wiring. recommended components lists on above application symbol part value manufacturer series l coil 4.7 h sumida cmd6d11b tdk vlf5014at-4r7m1r1 c in ceramic capacitor 10 f kyocera cm316x5r106k10a c o ceramic capacitor 10 f kyocera cm316x5r106k10a c ith ceramic capacitor 1000pf murata grm18series r ith resistance v out =1.0v 4.3k ? rohm mcr10 4301 v out =1.2v 6.8k ? rohm mcr10 6801 v out =1.5v 9.1k ? rohm mcr10 9101 v out =1.8v 12k ? rohm mcr10 1202 * the parts list presented above is an example of recommended pa rts. although the parts are sound, actual circuit characteristi cs should be checked on your application carefully before use. be sure to allow sufficient margins to accommodate variations between external devices and th is ic when employing the depicted circuit with other circuit constants modified. both stat ic and transient characteristics should be considered in estab lishing these margins. when switching noise is substantial and may impa ct the system, a low pass filter should be inserted between the vcc and pvcc pins, a nd a schottky barrier diode established between the sw and pgnd pins. i/o equivalence circuit fig.33 i/o equivalence circuit a dj v cc ith gnd en pv cc sw pgnd v cc r ith gnd c o c in v out en l c ith 1 2 3 4 8 7 6 5 en ? en pin ? sw pin pv cc sw pv cc pv cc ith ? ith pin v cc v cc a dj 10k ? adj pin
BD8964FVM technical note 12/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. notes for use 1. absolute ma ximum ratings while utmost care is taken to quality control of this pr oduct, any application that may exceed some of the absolute maximum ratings including the voltage applied and the operat ing temperature range may result in breakage. if broken, short-mode or open-mode may not be identif ied. so if it is expected to encounter with special mode that may exceed the absolute maximum ratings, it is requested to take necessary sa fety measures physically including insertion of fuses. 2. electrical potential at gnd gnd must be designed to have the lowest elec trical potential in any operating conditions. 3. short-circuiting between terminals, and mismounting when mounting to pc board, care must be taken to avoid mistak e in its orientation and alignment. failure to do so may result in ic breakdown. short-circuiting due to forei gn matters entered between output terminals, or between output and power supply or gnd may also cause breakdown. 4.operation in strong electromagnetic field be noted that using the ic in the strong electr omagnetic radiation can cause operation failures. 5. thermal shutdown protection circuit thermal shutdown protection circuit is the circuit designed to isolate the ic from thermal runaway, and not intended to protect and guarantee the ic. so, the ic the thermal shutdown protection circui t of which is once activated should not be used thereafter for any operation originally intended. 6. inspection with the ic set to a pc board if a capacitor must be connected to the pin of lower impeda nce during inspection with the ic set to a pc board, the capacitor must be discharged after each process to avoid stress to the ic. for electrostatic protection, provide proper grounding to assembling processes with special care taken in handling and storage. when connecting to jigs in the inspection process, be sure to turn off the power supply before it is connected and removed. 7. input to ic terminals this is a monolithic ic with p + isolation between p-substrate and each element as illustrated below. this p-layer and the n-layer of each element form a p-n junction, and various parasitic element are formed. if a resistor is joined to a transistor terminal as shown in fig 34. p-n junction works as a parasitic diode if the following rela tionship is satisfied; gnd>terminal a (at resistor side), or gnd>terminal b (at transistor side); and if gnd>terminal b (at npn transistor side), a parasitic npn transistor is activated by n-layer of ot her element adjacent to the above-mentioned parasitic diode. the structure of the ic inevitably forms parasitic elements, the activation of which may cause interference among circuits, and/or malfunctions contributing to breakdown . it is therefore requested to take care not to use the device in such manner that the voltage lowe r than gnd (at p-substrate) may be applied to the input terminal, which may result in activation of parasitic elements. fig.34 simplified structure of monorisic ic 8. ground wiring pattern if small-signal gnd and large-current gnd are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal gnd. pay attention not to cause fluctuations in the gnd wiring pattern of external parts as well. 9 . selection of inductor it is recommended to use an inductor with a series resistance element (dcr) 0.1 ? or less. note that use of a high dcr inductor will cause an inductor loss, resulting in decreased output voltage. should this condition continue for a specified period (soft start time + timer latch time), output short circ uit protection will be activated and output will be latched off. when using an inductor over 0.1 ? , be careful to ensure adequate margins for variation between external devices and this ic, including transient as well as static characteristics. furthermore, in any case, it is recommended to start up the output with en after supply voltage is within operation range. resistor transistor (npn) n n n p + p + p p substrate gnd parasitic element pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a p aras iti c element pin b other adjacent elements e b c gnd p aras iti c element
BD8964FVM technical note 13/13 www.rohm.com 2009.05 - rev.a ? 2009 rohm co., ltd. all rights reserved. ordering part number b d 8 9 6 4 f v m - t r part no. part no. package fvm:msop8 packaging and forming specification tr: embossed tape and reel (msop8) (unit : mm) msop8 0.08 s s 4.00.2 8 3 2.80.1 1 6 2.90.1 0.475 4 57 (max 3.25 include burr) 2 1pin mark 0.9max 0.750.05 0.65 0.080.05 0.22 +0.05 ?0.04 0.60.2 0.290.15 0.145 +0.05 ?0.03 4 + 6 ?4 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin
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